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Thick film technology has been exploited in the development and manufacture of several new low power (1 watt) audio amplifiers in a hybrid integrated circuit form. This paper describes the merits and limitations of thick film hybrid techniques and discusses several practical amplifier circuits which demonstrate the application of this art.
Author (s): Haas, George C.;
Affiliation:
Motorola Semiconductor Products, Inc., Phoenix, AZ
(See document for exact affiliation information.)
AES Convention: 31
Paper Number:494
Publication Date:
1966-10-06
DOI:
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Haas, George C.; 1966; Thick Film Integrated Circuits for Audio Amplifiers [PDF]; Motorola Semiconductor Products, Inc., Phoenix, AZ; Paper 494; Available from: https://aes.org/publications/elibrary-page/?id=947
Haas, George C.; Thick Film Integrated Circuits for Audio Amplifiers [PDF]; Motorola Semiconductor Products, Inc., Phoenix, AZ; Paper 494; 1966 Available: https://aes.org/publications/elibrary-page/?id=947
@inproceedings{Haas1966thick,
title={{Thick Film Integrated Circuits for Audio Amplifiers}},
author={Haas, George C.},
year={1966},
month={oct},
booktitle={Journal of the Audio Engineering Society},
publisher={Paper 494; AES Convention 31; October 1966},
number={494},
organization={AES},
}
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