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Thick Film Integrated Circuits for Audio Amplifiers

Thick film technology has been exploited in the development and manufacture of several new low power (1 watt) audio amplifiers in a hybrid integrated circuit form. This paper describes the merits and limitations of thick film hybrid techniques and discusses several practical amplifier circuits which demonstrate the application of this art.

Author: Haas, George C.
Affiliation: Motorola Semiconductor Products, Inc., Phoenix, AZ
AES Convention:31 (October 1966) Paper Number:494 Import into BibTeX

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