The increase in sensitivity of silicon condenser microphones (smaller than 30mm3 for hearing aid applications), led to more advanced models for the transducer acoustic microstructures and an electrostatic coupling model which considers the diaphragm deflection. The global optimization of the microphone, and a SPICE simulation, gave a sensitivity greater than 10mV/Pa, a thermal noise of 23 dB(A) with a bandwidth of 8 kHz.
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