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Audio Capture Using Piezoelectric Sensors on Vibrating Panel Surfaces

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The microphone systems employed by smart devices such as cellphones and tablets require case penetrations that leave them vulnerable to environmental damage. A structural sensor mounted on the back of the display screen can be employed to record audio by capturing the bending vibration signals induced in the display panel by an incident acoustic wave - enabling a functional microphone on a fully sealed device. Distributed piezoelectric sensing elements and low-noise accelerometers were bonded to the surfaces of several different panels and used to record acoustic speech signals. The quality of the recorded signals was assessed using the speech transmission index, and the recordings were transcribed to text using an automatic speech recognition system. Although the quality of the speech signals recorded by the piezoelectric sensors was reduced compared to the quality of speech recorded by the accelerometers, the word-error-rate of each transcription increased only by approximately 2%on average, suggesting that distributed piezoelectric sensors can be used as a low-cost surface microphone for smart devices that employ automatic speech recognition. A method of crosstalk cancellation was also implemented to enable the simultaneous recording and playback of audio signals by an array of piezoelectric elements and evaluated by the measured improvement in the recording’s signal-to-interference ratio.

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Permalink: https://www.aes.org/e-lib/browse.cfm?elib=22072


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