Headphone design using lumped-parameter analysis and analogous circuits is described. Specifically a model of a dynamic driver in a circumaural enclosure is developed, but the approach may be applied to other drivers and enclosure types. Models are presented which illustrate key design constraints such as leak behavior, open / closed back approaches, cup attenuation, cushion compliance and headband tension. Limitations of the lumped parameter approach are discussed, following which an introduction to analyticalmodal and numerical modeling is presented.
本文描述了使用集总参数分析和模拟电路设计耳机的方法，特别建立了耳罩式耳机的动圈驱动器模型，这个方法也可以推广应用于其他类型的驱动器和耳机样式。模型说明了关键的设计约束条件，例如漏音、开/闭后壳、耳壳衰减、耳垫柔软度、头带张力等。文章还讨论了集总参数设计方法的局限性，然后介绍了分析模型和数值建模方法。
https://www.aes.org/e-lib/browse.cfm?elib=17274
Click to purchase paper as a non-member or login as an AES member. If your company or school subscribes to the E-Library then switch to the institutional version. If you are not an AES member and would like to subscribe to the E-Library then Join the AES!
This paper costs $33 for non-members and is free for AES members and E-Library subscribers.
Learn more about the AES E-Library
Start a discussion about this paper!
