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A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling

In order to predict low frequency performance of loudspeaker systems, the lumped parameter model is very useful. However, it doesn¢¢ç¯t consider the enclosure geometry. Therefore, in some special cases, it makes serious deviation between simulation and experimental result. According to recent slim trend in IT devices, the majority of flat panel TVs and mobile devices adopt not only thin and long enclosures but also front radiating structures with waveguide. This loudspeaker system could be simplified as a vented band-pass enclosure. However due to the negligence of geometry, the effects of vent and driver location can't be considered. This paper discusses a computational model of the complicated vented band-pass enclosure using Backman¢¢ç¯s low-frequency method for slim type band-pass enclosure model. Simulation results were compared with experimental results to verify the validity of the computational model.

Authors: Kim, Jongbae; Lee, Gyeong-Tae; Kim, Jongje
Affiliation: Samsung Electronics Co., Ltd., Suwon City, Gyeong-Gi Do, Korea
AES Convention:131 (October 2011) Paper Number:8499 Import into BibTeX
Subject:Transducers and Audio Equipment

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