A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling
In order to predict low frequency performance of loudspeaker systems, the lumped parameter model is very useful. However, it doesn¢¢ç¯t consider the enclosure geometry. Therefore, in some special cases, it makes serious deviation between simulation and experimental result. According to recent slim trend in IT devices, the majority of flat panel TVs and mobile devices adopt not only thin and long enclosures but also front radiating structures with waveguide. This loudspeaker system could be simplified as a vented band-pass enclosure. However due to the negligence of geometry, the effects of vent and driver location can't be considered. This paper discusses a computational model of the complicated vented band-pass enclosure using Backman¢¢ç¯s low-frequency method for slim type band-pass enclosure model. Simulation results were compared with experimental results to verify the validity of the computational model.
Click to purchase paper or login as an AES member. If your company or school subscribes to the E-Library then switch to the institutional version. If you are not an AES member and would like to subscribe to the E-Library then Join the AES!
This paper costs $33 for non-members, $5 for AES members and is free for E-Library subscribers.