With the development of new space-efficient display technologies over the last years has come the trend to overall decrease thickness of consumer electronics such as televisions. This slim form factor creates a challenge for the design of integrated audio systems because it severely limits the physical performance possibilities of any acoustic transducer. For the most part, modern DSP and amplifier technologies have been able to utilize the transducer up to its performance limits and thus maintained the audio quality, however this will not be enough if a further thickness reduction is desired. This paper discusses the physical limits of the current designs and suggests a new layout of a moving-coil transducer for ultra-slim applications.
Click to purchase paper as a non-member or login as an AES member. If your company or school subscribes to the E-Library then switch to the institutional version. If you are not an AES member and would like to subscribe to the E-Library then Join the AES!
This paper costs $33 for non-members and is free for AES members and E-Library subscribers.