This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield. The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.
Download Now (561 KB)
The Engineering Briefs at this Convention were selected on the basis of a submitted synopsis, ensuring that they are of interest to AES members, and are not overly commercial. These briefs have been reproduced from the authors' advance manuscripts, without editing, corrections, or consideration by the Review Board. The AES takes no responsibility for their contents. Paper copies are not available, but any member can freely access these briefs. Members are encouraged to provide comments that enhance their usefulness.