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M. Hänsler, G. Muraro, C. Novotny, R. Murphy, R. Murphy, J. Spötl, and A. Rusconi Clerici, "MEMS based Audio Speaker Module," Engineering Brief 577, (2020 May.). doi: M. Hänsler, G. Muraro, C. Novotny, R. Murphy, R. Murphy, J. Spötl, and A. Rusconi Clerici, "MEMS based Audio Speaker Module," Engineering Brief 577, (2020 May.). doi:
Abstract: This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield. The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.

@article{hänsler2020mems,
author={hänsler, markus and muraro, giacomo and novotny, christian and murphy, richard and murphy, richard and spötl, jakob and rusconi clerici, andrea},
journal={journal of the audio engineering society},
title={mems based audio speaker module},
year={2020},
volume={},
number={},
pages={},
doi={},
month={may},} @article{hänsler2020mems,
author={hänsler, markus and muraro, giacomo and novotny, christian and murphy, richard and murphy, richard and spötl, jakob and rusconi clerici, andrea},
journal={journal of the audio engineering society},
title={mems based audio speaker module},
year={2020},
volume={},
number={},
pages={},
doi={},
month={may},
abstract={this paper introduces a novel mems technology based audio module for in-ear headphone applications. the device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. it is a complete audio solution containing a surface mounted mems speaker, an integrated audio amplifier with energy recovery, a digital mems microphone as well as digital signal processing for equalization and open-loop predistortion. the module can be manufactured in an smt line enabling fully automated high-volume mass production with low costs and high yield. the mechanical structure and key benefits of a mems based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.},}

TY - paper
TI - MEMS based Audio Speaker Module
SP - EP -
AU - Hänsler, Markus
AU - Muraro, Giacomo
AU - Novotny, Christian
AU - Murphy, Richard
AU - Murphy, Richard
AU - Spötl, Jakob
AU - Rusconi Clerici, Andrea
PY - 2020
JO - Journal of the Audio Engineering Society
IS -
VO -
VL -
Y1 - May 2020 TY - paper
TI - MEMS based Audio Speaker Module
SP - EP -
AU - Hänsler, Markus
AU - Muraro, Giacomo
AU - Novotny, Christian
AU - Murphy, Richard
AU - Murphy, Richard
AU - Spötl, Jakob
AU - Rusconi Clerici, Andrea
PY - 2020
JO - Journal of the Audio Engineering Society
IS -
VO -
VL -
Y1 - May 2020
AB - This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield. The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.