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Thermal Simulation of Loudspeakers

This paper describes the development of a system to simulate accurately the temperatures of the voice coil and magnet assembles in moving coil loudspeakers in real-time for any program material. After initial parameter measurements on the loudspeaker there is no further need for connection to the loudspeaker, the temperatures can be simulated independently. The simulation has been verified through measurements performed on bass, midrange, and tweeter units.

Author: Chapman, Peter John
Affiliation: Bang & Olufsen A/S, Struer, Denmark
AES Convention:104 (May 1998) Paper Number:4667 Import into BibTeX
Subject:Transducers

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