Synchronized Swept-Sine: Theory, Application, and Implementation - October 2015
Effect of Microphone Number and Positioning on the Average of Frequency Responses in Cinema Calibration - October 2015
The Measurement and Calibration of Sound Reproducing Systems - July 2015
New work in transducer engineering is directed toward the use of silicon technologies for the fabrication of tiny microphones. For such devices, a number of conventional transduction methods are suitable, such as the condenser, piezoelectric, and piezoresistive principles. Under study are also microphones based on sound-wave-induced modulation of the drain current in a field-effect transistor or acoustic sensors, depending on the modulation of light propagation in a micromachined waveguide. Experimental silicon sensors according to all these principles have recently been built, with some of them showing already good acoustic properties. Most advanced are two-chip condenser microphones with external biasing. Electret biasing and one-chip designs made with sacrificial-layer techniques are also under study. Future work will be concerned with the improvement of the characteristics of all silicon microphones and the integration of amplifiers or signal-processing electronics on the microphone chip. Advantages of silicon microphones are their small size (membrane areas ((symbol)1 mm2), low vibration sensitivity due to small diaphragm thickness (-1µm), the possibiity of integrating sensor and amplifier on a single chip, and potentially low cost due to batch processing.
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