Binaural spatialization over a bone conduction headset in the vertical plane was investigated using inexpensive and commercially available hardware and software components. The aim of the study was to assess the acuity of binaurally spatialized presentations in the vertical plane. The level of externalization achievable was also explored. Results demonstrate good correlation between established perceptual traits for headphone based auditory localization using non-individualized HRTFs, though localization accuracy appears to be significant worse. A distinct pattern of compressed localization judgments is observed with participants tending to localize the presented stimulus within an approximately 20° range on either side of the inter-aural plane. Localization error was approximately 21° in the vertical plane. Participants reported a good level of externalization. We’ve been able to demonstrate an acceptable level of spatial resolution and externalization is achievable using an inexpensive bone conduction headset and software components.

Authors: Amit Barde; Robert W. Lindeman; Gun Lee; Mark Billinghurst
Affiliations: Empathic Computing Laboratory, Auckland Bioengineering Institute, University of Auckland, Auckland; HITLab NZ, University of Canterbury, Christchurch; Empathic Computing Laboratory, School of ITMS, University of South Australia, Mawson Lakes(See document for exact affiliation information.)
AES Conference: 2019 AES International Conference on Headphone Technology (August 2019)
Paper Number: 3
Publication Date: August 21, 2019 Import into BibTeX
Permalink: https://www.aes.org/e-lib/browse.cfm?elib=20518

Click to purchase paper as a non-member or login as an AES member. If your company or school subscribes to the E-Library then switch to the institutional version. If you are not an AES member and would like to subscribe to the E-Library then Join the AES!

This paper costs $33 for non-members and is free for AES members and E-Library subscribers.

Learn more about the AES E-Library

E-Library Location:   /conf/2019/headphone/2019_headphone_technology_paper_3.pdf

Start a discussion about this paper!